App & Solution

Prepreg laser cutting

Fingerprint module precision cutting/ SIP encapsulation cutting

FR4 PCB depaneling
Fr-4
With the rapid improvement of laser processing efficiency, the FR-4 stamp hole depaneling is rapidly changing into a full-cut. Laser full-cut depaneling is increasingly used in the field of consumer electronics and automotive electronics, and rapidly expanded to epoxy resin-based composite materials including SIP.