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蓝宝石A 450.jpg
Sapphire drilling and cutting
玻璃 730.jpg
Thick glass drilling and cutting
石英 730.jpg
Quartz cutting

Transparent brittle material

DCT DirectLaser B series equipment is suitable for processing glass, sapphire and other brittle materials including shaped screens. In addition, DCT provide also equipment which are suitable for applications in mass production such as thick glass drilling, cutting and quartz cutting.