DirectLaser SF6 Top-level Laser Precision Cutting Equipment
DirectLaser SF6 classic models of S series, the equipment using the classic bridge structure, the use of X/Y axis separation motion structure, processing head moves on a stable bridge around the X direction, workpiece clamping platform moves along the Y axis back-and-forth. Two axes are independent and not interfere with each other.
DirectLaser S series with high precision, fast speed improves the capacity, and also further reduce production costs. DCT DirectLaser series equipment, with its high flexibility, large capacity features create new business opportunities for customers.
Depaneling with die cutting or other traditional methods need mold and fixture, which increase the production time and costs. DCT DirectLaser S series use laser as a tool, with computer data driven processing, the processing data import is simpler and faster. It can save the mold, tool cost and increase the efficiency, flexibility and quality improvement at the same time. For assembled PCBs, function PCBs, due to the use of contactless processing, can be used in the whole process of standard carrier. DirectLaser S series can be easily integrated into the existing production line at any time.
Features
Directly data driven
High level automation
Break through mechanical limits
Precise laser control
Cold cutting with picosecond Laser
Product parameters
Technical data | DirectLaser SF6 |
Working area | 533mm x 610mm |
Laser wave length | 1,064nm/532nm/355nm |
Minimum gap | 25μm* |
Minimum trace | 20μm* |
Processing speed | 25cm²/min* |
Reapetative accuracy | ±2μm |
Resolution of scan feld | ≤1μm |
X/Y resolution | 0.5μm |
Weight | Approx. 1,700kg |
Data processing software | CircuitCAM 7 LaserPlus |
Machine software | DreamCreaTor 3 |
Exhaust unit | 210mᵌ/hr,220VAC,1.3kW |
Camera positioning | Automatic CCD camera fiducial positioning |
Workpiece fixation | Vacuum absorbing platform |
Power requirements | 380VAC/50Hz,2.4kW |
Ambient temperature | 22℃±2℃ |