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MP series Multilayer press

DCT MP series high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs according to industry standards. This was designed for high precision, varieties of multi-layer PCB. MP multilayer press is also suit for high frequency substrate with high pressure temperature, LCP and other materials, also suitable for thermoplastic, thermosetting materials such as welding resistance film, graphite, etc. it is a perfect solution for single or small batch production in the laboratory.


Features

wide adaptability and high flexibility

High temperature, high pressure, wide adaptability

High adjustable system

Precise temperature control, stable pressure, high sensitivity and adjustable system

Efficient and easy to use

Fast heating, good insulation, compact, efficient and easy to use

Precise time matching

Accurately match Temperature, pressure and time, essential equipment for multilayer PCBs

High performance and quality

High performance and quality with reasonable price, first choice for thermal press processing

Product parameters

Technical data

MP300

MP300D

Max. wiring area

285×205 mm

305×230 mm

Borad size

305×230 mm

355×280 mm

Pressure

300 N/cm²  

300 N/cm²  

Max. Temperature

350 ℃

350 ℃

Max. layer at one time

2

6

Max. layer

8

8

Pressing time

Approx.90 min.

Approx.90 min.

Automatic hydraulic device

standard

standard

Suitable substrate materials

FR4、PTFE、LCP、graphite etc.

FR4、PTFE、LCP、graphite etc.

 

Technical data

MP300

MP300D

Power requirement

220V/50Hz, 2.1 kW

220V/50Hz, 3kW

Dimension (WxDxH)

550×550×700 mm

600×600×1,330 mm

Weight

180 kg**

450 kg**