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TP Series Through-hole plating equipment

DCT hole metallization equipment, use carbon film hole metallization process, through the most simple and reliable steps such as oil removal, washing, black hole, copper plating to achieve PCB reliable interlayer conduction.


Features

Ensure more uniform plating

Arc anode ensure more uniform plating

Revertive impulse power supply

Revertive impulse avoid “dog bones” effect

Design makes operation easily

Humanistic design makes operation easily

Equipped with cycle filtration

Circulation filtration, air stirring, swing speed regulation benefit better plating quality

Tank for OSP process

Equipped with OSP tank for OSP process

Product parameters

Technical data

TP300B

TP300/TP300P

TP400/TP400D

TP600D

Max. board size

230×305 mm

230×305 mm

400×300 mm

600×600 mm

Min. aperture

0.3 mm

0.2 / 0.15 mm

0.2 mm

0.2 mm

Activaton liquid

Carbon black colloids

Electric power type

DC

DC/ Revertive impulse current

DC

DC

Cathode swing

None

Yes, adjustable speed

Yes,Fix speed

Yes,Fix speed

Anode form

Arc

Arc

Plate

Plate

Air agitation

None

Yes

Yes

Yes

Circle filtration

None

Yes

Yes

Yes

Water washing

Yes

Yes

Yes

Yes

Number of plating tank

1

1

1   / 2

4

Power supply

220VAC/50Hz

220VAC/50Hz

220VAC/50Hz

220VAC/50Hz

Power consume

1 kW

1.6 kW

2 kW / 2.2 kW

5 kW

Dimension (W x H x D)

1,000×600×470mm

1,000×600×470mm

1,738×826×1,170mm

2,000×1,100×1,300mm

Weight

32 kg

36 kg

250 / 280 kg

900 kg